HyPox DA323 Adduct of DGEBA resin and dimer fatty acid 67989-52-0 CVC Epoxy Resins >> Bisphenol A based HyPox DA323 is an adduct of a DGEBA resin and a dimer fatty acid. At room temperature HyPox DA323 is a semi-solid which requires mild heating to assist flow or pumping. The introduction of the fatty acid to the DGEBA backbone yields a resin which will impart a degree of flexibility to cured epoxy formulations. HyPox DA323 is usually blended with other epoxy resins and/or diluents to improve thermal shock, and impact resistance. Improvements in adhesion and peel strength will also be realized. These improvements occur, however, with some sacrifice in heat resistance as exemplified by a lowering of Tg with increasing HyPox DA323 concentration. HyPox DA323 is compatible with all standard epoxy resins and curing agents. It is used in adhesives, encapsulating, potting, coatings, toughening of prepreg and composites. Dimer acid adducted to an epoxidized bisphenol A resin. Improves adhesion, peel strength, thermal shock and impact resistance. Compatible with all standard epoxy resins and curing agents.