Omicure 33DDS Ground 3,3’-Diaminodiphenyl sulfone CVC Crosslinking / Coupling / Curing Agents >> Amine Epoxy Resins Coatings Electrical / Electronics OMICURE ® 33DDS Ground 3,3’ Diaminodiphenyl Sulfone High Temperature Aromatic Amine Curing Agent OMICURE 33DDS is a newly developed version of 3,3' Dia-mino Diphenyl Sulfone. High purity 33DDS is produced in a unique proprietary process using readily available raw materials. These raw materials are halogen free so the ionic levels of OMICURE 33DDS are significantly lower than 3,3' Diamino Diphenyl Sulfone recovered as a reaction by-product. As an epoxy curing agent OMICURE 33DDS is an effec-tive, safer to use replacement for Methylene Dianiline (MDA). Due to its asymmetric structure, 33DDS can yield cured systems with higher compressive strength, less brit-tleness and higher heat deflection temperatures than MDA. Unlike 4,4' DDS, OMICURE 33DDS can cure at rates com-parable to MDA. In polyimid production OMICURE 33DDS exhibits good reactivity. Polyimides produced using 33DDS exhibit higher temperature performance. Chemical Resistant Coatings High Temperature Electrical Varnishes Ground high temperature aromatic amine. Used as a curing agent for epoxy in chemical resistant coatings and high temperature electrical varnishes. Possesses low ionic level. Provides high compressive strength, low brittleness and high heat deflection temperatures. Offers good reactivity in polyimide production with high temperature performance. Can be used as a polyurethane crosslinking accelerator.