Omicure DDA 10 Micronized dicyandiamide 461-58-5 CVC Crosslinking / Coupling / Curing Agents >> Amide Epoxy Resins Coatings >> Powder Coatings Powder coating OMICURE ® DDA SERIES Micronized Dicyandiamide Systems OMICURE DDA is Dicyandiamide, a solid latent curing agent for epoxy resins. It is offered in several grades de-pending on the desired particle size. OMICURE DDA prod-ucts are dispersed into resin systems where they remain stable until activated by heat. Uncatalyzed, dicyandiamide has an activation temperature of about 350°F and a formu-lated storage stability of over six months. When catalyzed with other latent accelerators like the OMICURE U series of substituted ureas, one component adhesive and sealant formulas can be prepared with cure temperatures of 225-250° F and excellent stability. Epoxy systems cured with OMICURE DDA are character-ized by outstanding adhesion making them the preferred choice for adhesive formulations. They are compatible with all epoxy resins, including Bisphenol A and F epoxies and epoxy novolacs. They can be used with diluted or undi-luted resins and are compatible with a wide variety of fillers and pigments. OMICURE DDA is safe to handle and is considered non-toxic. Powder Epoxy Coatings Micronized dicyandiamide. Used as a curing agent for epoxy resins in powder epoxy coatings. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies and epoxy novolacs), with diluted or undiluted resins and with a wide variety of fillers and pigments.