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Omicure® DDA 50
CVC
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Additive
Crosslinking / Coupling / Curing Agents >> Amide

Chemical composition:Micronized dicyandiamide
Physical form:Information available upon registration
CAS Number:461-58-5

Product description
Micronized dicyandiamide. Used as a curing agent for epoxy resins in powder epoxy coatings. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility... More information available upon registration

Typical propertiesValueUnit
AssayInformation available upon registration%
Melting pointInformation available upon registration°C
Melamine contentInformation available upon registration%
Moisture content (loss @ 105°C)Information available upon registration%
Silica content as anti-caking aidInformation available upon registration%
Mean particle sizeInformation available upon registrationmicrons

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