Omicure U-210M Monuron n-(4-chlorophenyl) - n, n-dimethyl urea 150-68-5 CVC Catalyst / Accelerator >> Amine Crosslinking / Coupling / Curing Agents >> Amide Epoxy Resins Coatings >> Powder Coatings Powder coating OMICURE U-210M represents the micronized grade of OMICURE U-210. OMICURE U-210, an aromatic substituted urea, is intended for use as a latent accelerator for the dicyandiamide cure of epoxy resins. The addition of OMICURE U-210 to epoxy/dicy formulations reduces the time and/or temperature required to cure these shelf stable one part products. Compared to the other CVC substituted ureas, OMICURE U-210 shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels of OMICURE U-210 are < 5 phr. Curing can be accomplished in about 70 minutes at 100°C and in less than 20 minutes at 140°C. Actual cure times are dependant on the composition of the formulated compound, the curing schedule and the application. As a latent accelerator in the dicyandiamide cure of epoxy resins used in adhesives, powder coatings, prepregs, encapsulation, reinforcements. Aromatic substituted urea. Micronized grade of OMICURE U-210. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder coatings.