Cymel 1135 Alkylated, methylated/butylated melamine formaldehyde Cytec Crosslinking / Coupling / Curing Agents >> Amine >> Melamine-formaldehyde Acrylic/Acrylate Resins Alkyd Resins Cellulosic Resins Epoxy Resins Polyester Soluble in alcohols, esters, ketones, glycols and glycol ethers Insoluble in water CYMEL 1135 resin is a low free formaldehyde, highly monomeric, highly alkylated, methylated/butylated melamine formaldehyde crosslinking agent for polymers and resins containing either hydroxyl, carboxyl and amide functionalities. Because of its high degree of alky-lation and high monomer content, it is especially recom-mended for low VOC systems, those applications requiring high film flexibility, and those systems where recoat adhesion must be optimized. CYMEL 1135 resin is compatible with a wide range of polymers including most thermoset acrylics, polyesters, alkyds, epoxies and cellulosics. As with other fully or highly alkylated melamine resins, the reaction of CYMEL 1135 resin with the functional sites of other polymers is catalyzed by the presence of a strong acid catalyst (pKa value of less than 1). Usually, 0.2-0.4% p-toluene sulfonic acid on binder solids is rec-ommended for a 15 minute bake schedule at 120°-150°C. CYMEL 1135 resin is an effective crosslinking agent and has a low tendency towards self-condensation. Because of this low tendency and its high monomer content, it can provide films with high flexibility and formability. This is particularly true when used to crosslink polymers which are inherently flexible, such as some polyesters. As supplied, CYMEL 1135 resin is stable for several months to several years at storage temperatures ranging from 70°F to 120°F(21°Cto49°C), provided that storage conditions exclude water from the container. In a formu-lated system, stability can be improved by the use of a blocked acid catalyst, or by the addition of a stabilizing alcohol to the formulation. Low free formaldehyde, highly monomeric, highly alkylated, methylated/butylated melamine formaldehyde crosslinking agent. Used for polymers and resins containing either hydroxyl, carboxyl or amide functionalities. Possesses high degree of alkylation and high monomer content. Suits especially for low VOC systems. Offers high film flexibility and recoat adhesion. Gives compatibility with a wide range of polymers including most thermoset acrylics, polyesters, alkyds, epoxies and cellulosics.