Granular, unmicronized dicyandiamide. Used as a curing agent for epoxy resins in powder epoxy coatings. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding...

An ultra-micronized grade of Dicyandiamide. Contains approximately 2-3% silica as an anti-caking aid. Provides good dispersion, prevents settling and maximizes reactivity. Compatible with all epoxy...

Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent...

Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies...

Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F...

Semi-Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F...

Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Shows a long latency in formulated systems containing Dicy and epoxy. Suggested use levels < 5 phr. Used as a latent...

Monuron N-(4-Chlorophenyl) - N, N-Dimethyl Urea, an aromatic substituted urea. Micronized grade of OMICURE U-210. Used as a latent accelerator in the dicyandiamide cure of epoxy resins in powder...

Phenyl Dimethyl Urea, an aromatic substituted urea. Reduces time and temperature of curing. Does not contain any chlorine. Most similar in structure to Monuron and Diuron. Used as a latent accelerator...

Toluene Bis Dimethyl Urea, an aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent accelerator in the...

Toluene Bis Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Provides great degree of acceleration to epoxy/dicy formulations. Used as a latent...

Aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a latent...

Micronized aromatic substituted urea. Reduces time and temperature of curing. Provides good acceleration, long shelf life and maintenance of cured properties in epoxy/dicy formulations. Used as a...