Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy...

Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy...

Modified polyamine. Acts as a latent curing agent for one-component epoxy formulations. Provides a good balance of low temperature activation, good shelf stability and high glass transition...

Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid epoxy...

Micronized grade of dicyandiamide. Acts as a latent curing agent for epoxy resins. Fine particle size provides enhanced reactivity versus coarser grades. Shows very good dispersibility in liquid...

Phenolic hardner and a reaction product of liquid epoxy resin and bisphenol- A containing a curing accelerator and a polyacrylate flow modifier. Used for powder coating applications. Offers...

Phenolic hardner and a reaction product of liquid epoxy resin and bisphenol- A containing a curing accelerator and a polyacrylate flow modifier. Used for powder coating applications. Offers...

Phenolic hardner and a reaction product of liquid epoxy resin and bisphenol- A containing a curing accelerator and a polyacrylate flow modifier. Used for powder coating applications. Offers...

Phenolic hardener (solid reaction product of liquid epoxy resin and bisphenol-A containing a curing accelerator). Used for powder coating applications. Offers compatibility with epoxy resins. Suits...

Phenolic hardener (unmodified solid reaction product of liquid epoxy resins and bisphenol-A). Used for powder coating applications. Offers compatibility with epoxy resins. Suits for decorative or...

Granular, unmicronized dicyandiamide. Used as a curing agent for epoxy resins in powder epoxy coatings. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding...

An ultra-micronized grade of Dicyandiamide. Contains approximately 2-3% silica as an anti-caking aid. Provides good dispersion, prevents settling and maximizes reactivity. Compatible with all epoxy...

Phenyl Dimethyl Urea, a micronized aromatic substituted urea. Reduces time and temperature of curing. Most similar in structure to Monuron and Diuron. Does not contain any chlorine. Used as a latent...

Micronized dicyandiamide. Can be catalyzed with other latent accelerators. Provides very good stability, outstanding adhesion, compatibility with all epoxy resins (including Bisphenol A and F epoxies...

Unground grade of Dicyandiamide, a solid latent curing agent for epoxy resins. Primarily designed for use in solvent-based compositions. Compatible with all epoxy resins, including Bisphenol A and F...

Pyromellitic dianhydride. Used as a curing agent for epoxy resins used for the manufacture of coatings. Offers great heat resistance, very good electrical properties, very low volatility, high heat...

Pyromellitic dianhydride. Used as a curing agent for epoxy resins used for the manufacture of coatings. Offers great heat resistance, very good electrical properties, very low volatility, high heat...

Pyromellitic dianhydride. Used as a curing agent for epoxy resins used for the manufacture of coatings. Offers great heat resistance, very good electrical properties, very low volatility, high heat...

Versatile, chemically stable, free flowing pulverized amine adduct. Acts as an ultra rapid curing agent especially designed to cure epoxy resin powder coatings at temperatures down to 250 °F (121 °C)....

Pastillized imidazole adduct. Acts as a catalytic type curing agent. Used in decorative and functional powder coatings.

An accelerated form of dicyandiamide. Acts as a catalytic type curing agent. Possesses good film appearance and a high level of film properties. Used in thick film decorative or functional powder...

An accelerated form of dicyandiamide. Acts as a catalytic type curing agent. Used in powder coatings and to prepare thin film decorative powders.

Phenolic hydroxyl terminated solid flaked curing agent. Contains 2-methylimidazole that functions as an accelerator to reduce the cure cycle. Available in package to minimize the moisture pick up....

Heterocyllc compound with nitrogen. Acts as a low temperature quick curing agent. Strengthens the mechanical intensity and corrossion-resistant of coating film. Enhances the lusture. Used in epoxy...

Salt prepared from cyclic amidine and polycarboxylic acid. Acts as a curing agent for expoxy/polyester hybrid powder coatings with super matt-finish film of coatings and excellence of various...